Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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20 Years
Since 2006
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13.0W/mK Thermal Gap Filler Pad - 0.03-0.20 inch Thickness for Electronics Cooling

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5work days
Brand: ZIITEK
Product Description
High-Performance Thermal Gap Filler Pad
The TIF800QE series thermal interface material is engineered to efficiently fill air gaps between heat-generating components and heat sinks or metal baseplates. With excellent compliance and stable thermal conductivity, it ensures optimal heat transfer in various electronic applications.
Key Features
Superior Thermal Performance
High thermal conductivity of 13.0W/mK ensures efficient heat dissipation
Easy Application
Naturally tacky surface requires no additional adhesive coating
Excellent Flexibility
High compliance adapts to various pressure application environments
Customizable Options
Available in different thickness options from 0.03-0.20 inches (0.75-5.0mm)
Applications
  • Telecommunication equipment
  • Automotive electronics and EV battery packs
  • LED drivers and lighting systems
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • CPU, display cards, and motherboards
  • Heat dissipation structures for radiators
Technical Specifications
Property Value Test Method
Color Gray Visual
Construction Ceramic filled silicone elastomer -
Thickness Range 0.03-0.20 inch (0.75-5.0mm) ASTM D374
Density 3.7 g/cc ASTM D792
Hardness 35 Shore 00 ASTM 2240
Operating Temperature -40 to 200℃ -
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Thermal Conductivity 13.0W/m-K ASTM D5470
Flame Rating V-0 UL94(E331100)
Product Specifications
Standard thickness: 0.02 to 0.20 inches (0.50 to 5.0mm) with 0.01 inch (0.25mm) increments
Standard size: 16" x 16" (406mm x 406mm)
Available with fiberglass reinforcement for enhanced strength in thinner materials
Quality Certifications
ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL certified
TIF800QE Series 13.0W/mK Thermal Gap Filler Pad showing gray ceramic-filled silicone elastomer material
Manufacturer Information
Ziitek thermal conductive interface materials are manufactured in China and widely used in mainboards, VGA cards, notebooks, LCD TVs, LED power products, and various electronic applications.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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