TIF045-11 Thermal Conductive Gel 4.5W/mK Silicone Gap Filler for Electronics Cooling
TIF045-11 is a soft silicone gel-based thermal conductive gap filler with 4.5W/mK thermal conductivity. This advanced thermal interface material provides superior heat dissipation for high-power electronic components while maintaining excellent softness and low compression force.
- High thermal conductivity: 4.5 W/mK
- Soft composition with very low compression requirements
- Low thermal impedance for efficient heat transfer
- Compatible with automated dispensing equipment
- Proven long-term reliability and performance stability
- UL 94 V-0 flame rating for safety compliance
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 4.5 W/mK | ASTM D5470 |
| Thermal Impedance @10psi | 0.077 ℃.in²/W | ASTM D5470 |
| Thermal Impedance @50psi | 0.068 ℃.in²/W | ASTM D5470 |
| Operating Temperature | -45°C to 200°C | Ziitek Test Method |
| Density | 3.20 g/cc | ASTM D297 |
| Dielectric Strength | ≥4000 V/mm | ASTM D149 |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
- Heat-sink and frame assemblies
- LED backlight modules and LED lighting systems
- High-speed hardware drivers
- Micro heat pipes
- Vehicle engine controllers
- Telecommunications equipment
- Semiconductor automatic laboratory equipment
- Flip-chip microprocessors and BGA packages
Standard packaging: 30 cc per piece (98 pieces per box) or 300 cc per piece (6 pieces per box). Custom packaging available for automated production applications.
Ziitek maintains rigorous quality standards with total quality control processes. Our commitment includes quick response times, on-time delivery, and comprehensive technical support from our integrated team of sales, marketing, engineering, R&D, manufacturing, and logistics professionals.
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