Thermal Conductive Gap Pad 1.5W/mK Silicone Pad for LED Telecommunication Hardware
Price:
Negotiation
MOQ:
1000pcs
Delivery Time:
3-5 days
Brand:
ZIITEK
Product Description
Soft Characteristics Thermal Gap Filler with 1.5W/m-K Thermal Conductivity and UL 94-V0 Fire Rating
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials. Our extensive experience enables us to provide optimal assistance in thermal engineering, offering customized products, comprehensive product lines, and flexible production capabilities.
Product Description
The TIF® 180-02F Series is a silicone-based, thermally conductive gap pad featuring an unreinforced construction for enhanced compliancy. This product offers low hardness, excellent conformability, and electrical isolation properties. The low modulus characteristics provide optimal thermal performance with easy handling, effectively transferring heat from electronic components to metal housings or dissipation plates, thereby improving efficiency and extending component lifespan.
Key Features
- High tack surface reduces contact resistance
- RoHS compliant 1.5 W/mK thermal conductivity
- UL recognized certification
- Fiberglass reinforced for puncture, shear and tear resistance
- Easy release construction
- Electrically isolating properties
- High durability performance
Applications
- CPU thermal management
- Display card cooling
- Mainboard/motherboard applications
- Notebook computers
- Power supply units
- Heat pipe thermal solutions
- Memory Modules
- Mass storage devices
- Automotive electronics
Typical Properties - TIF® 100-02F Series
| Property | Value | Test Method |
|---|---|---|
| Color | Gray white | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ****** |
| Density (g/cm³) | 2.3 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 | 0.030~0.200 0.25~0.50 | 0.75~5.00 |
ASTM D374 |
| Hardness (Shore 00) | 65 | 60 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @ 1MHz | 4.0 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | ＞1.0×10¹² | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 ISO22007 |
Product Specifications
Product Thicknesses: 0.010" (0.25mm) ~ 0.200" (5.00mm) with increments of 0.010" (0.25mm)
Product Sizes: 16" x 16" (406mm x 406mm)
Component Codes
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or additional information, please contact us.
Ziitek Corporate Culture
Quality
Do it right the first time, total quality control
Effectiveness
Work precisely and thoroughly for effectiveness
Service
Quick response, on-time delivery and excellent service
Team Work
Complete teamwork across all departments to support and service customer satisfaction
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai