TIF500US 2.6W/mK CPU Thermal Pad - 0.010" to 0.200" Thickness Range for Motherboard Cooling
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
Product Overview
TIF500US Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from heat-generating electronic components, thereby enhancing efficiency and extending component lifespan.
Key Features
- Excellent thermal conductivity: 2.6W/mK
- Available in various thickness options
- Moldable for complex part geometries
- Broad range of hardness options
- High tack surface reduces contact resistance
- Easy release construction
Applications
CPU cooling, Memory Modules, LED TV/Lighting, CD/DVD-ROM cooling, DC Power Adapters, Telecommunication hardware, Motherboards, IT infrastructure, GPS navigation devices, LED flexible strips, and other portable electronic devices.
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 2.6W/m-K | ASTM D5470 |
| Thickness Range | 0.010" - 0.200" | ASTM C351 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >10000 VAC | ASTM D412 |
| Continuous Use Temperature | -40 to 160℃ | - |
| Fire Rating | 94 V0 | UL equivalent |
| Volume Resistivity | 4.2×10¹³ Ohm-meter | ASTM D257 |
Certifications
ISO9001:2015
ISO14001:2004
IATF16949:2016
IECQ QC 080000:2017
UL
Product Images
Technical Documentation
Quality Assurance
All thermal conductivity data is verified through actual testing using Hot Disk and ASTM D5470 methods. Our products undergo strict inspection to ensure consistent performance and reliability.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai