TIF500-50-11S CPU Thermal Pad 5.0 W/mK Grey Ceramic-Filled Silicone 0.5-5.0mm Thickness
Price:
0.1-10 USD/PCS
MOQ:
1000 pcs
Delivery Time:
3-8 work days
Brand:
Ziitek
Product Description
Product Overview
TIF500-50-11S Series thermal pads are high-performance ceramic-filled silicone rubber interfaces designed to fill air gaps between heating elements and heat dissipation components. These flexible materials effectively transfer heat to metal housings or cooling plates, enhancing the efficiency and lifespan of electronic devices.
Key Features
- High thermal conductivity of 5.0 W/mK
- Excellent electrical isolation properties
- Available in multiple hardness options
- Flame rating: UL94 V-0 compliant
- Operating temperature range: -40°C to 160°C
- Dielectric breakdown voltage: >5500 VAC
Technical Specifications
| Property | Value |
|---|---|
| Product Name | TIF500-50-11S Series |
| Color | Grey |
| Construction | Ceramic filled silicone rubber |
| Specific Gravity | 3.15 g/cc |
| Hardness | 45 Shore 00 |
| Thermal Conductivity | 5.0 W/mK |
| Thickness Range | 0.5mm to 5.0mm |
Applications
- Mass storage devices
- Handheld portable electronics
- Audio and video components
- GPS navigation devices
- CD-ROM and DVD-ROM cooling systems
Available Thickness Options
Standard thicknesses range from 0.25mm (0.010") to 5.08mm (0.200") with multiple intermediate options available. Custom thicknesses can be requested.
Standard Sheet Sizes
- 8" x 16" (203mm x 406mm)
- 16" x 18" (406mm x 457mm)
Customization Options
- Pressure sensitive adhesive on one side (A1 suffix)
- Pressure sensitive adhesive on both sides (A2 suffix)
- Fiberglass reinforcement available
- Individual die-cut shapes upon request
Quality Assurance
- UL94 V-0, SGS and ROHS compliance
- Total quality control processes
- Free samples available for evaluation
- Confidentiality agreements and business secret contracts
Documentation
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai