TIF540US CPU Thermal Pad 2.6W/mK 1.0mm Thickness for Motherboard Cooling Applications

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description
Product Overview

The TIF540US CPU Thermal Pad delivers outstanding thermal performance with 2.6W/mK thermal conductivity, specifically designed for motherboard and mainboard applications. This cost-effective thermal interface material effectively fills air gaps between heating elements and heat dissipation components.

Key Features
  • High thermal conductivity: 2.6W/mK
  • Standard thickness: 1.0mm
  • Excellent moldability for complex parts
  • Broad range of hardness options available
  • High tack surface reduces contact resistance
  • Easy release construction for simple installation
  • Fire rating: UL 94 V0 compliant
Applications
  • Motherboards and mainboards
  • CPU cooling systems
  • LED TV and lighting systems
  • Telecommunication hardware
  • IT infrastructure components
  • GPS navigation and portable devices
  • Memory modules and power adapters
Technical Specifications
Property Value Test Method
Thermal Conductivity 2.6W/mK ASTM D5470
Thickness Range 0.040" to 0.200" (1.016mm to 5.080mm) ASTM C351
Hardness 45 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >10000 VAC ASTM D412
Operating Temperature -40°C to 160°C -
Volume Resistivity 4.2×10¹³ Ohm-meter ASTM D257
Fire Rating 94 V0 UL Equivalent
Quality Certifications
ISO9001:2015 • ISO14001:2004 • IATF16949:2016 • IECQ QC 080000:2017 • UL Certified
Product Images
TIF540US Thermal Pad product overview showing violet colored material TIF540US Thermal Pad technical specifications and application diagram TIF540US Thermal Pad quality testing and manufacturing process
Frequently Asked Questions
What are your payment terms?
For orders up to 2000 USD, we require T/T payment in advance. For established customers with consistent payment history, we can offer monthly or 30-day payment terms.
What thermal conductivity test methods are used?
All data in our specifications are actual tested values using Hot Disk and ASTM D5470 methods for thermal conductivity measurement.
Company Advantages

Ziitek maintains an experienced R&D team with comprehensive testing capabilities. We offer free samples, quality assurance contracts, and confidentiality agreements to ensure the best thermal solution for your specific application requirements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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