TIF5100US CPU Thermal Pad 2.6W/mK Thermal Conductivity 2.5mm Thickness for Motherboard Cooling
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
Product Overview
TIF5100US Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity enable effective coating of uneven surfaces, facilitating efficient heat transfer from electronic components to metal housings or cooling plates, thereby enhancing performance and extending component lifespan.
Key Features
- High thermal conductivity: 2.6W/mK
- Standard thickness: 2.5mm
- Excellent moldability for complex part geometries
- Available in broad hardness range options
- High tack surface reduces thermal contact resistance
- Easy release construction for simplified installation
Applications
CPU cooling, memory modules, LED TV/LED lighting systems, CD/DVD-ROM drives, DC power adapters, telecommunications hardware, motherboards, IT infrastructure, GPS navigation devices, LED flexible strips, and various portable electronic devices.
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 2.6W/m·K | ASTM D5470 |
| Thickness Range | 0.100" | ASTM C351 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500VAC | ASTM D412 |
| Continuous Use Temperature | -40 to 160°C | - |
| Fire Rating | 94 V0 | UL equivalent |
| Specific Gravity | 2.10 g/cc | ASTM D297 |
Quality Certifications
ISO9001:2015
ISO14001:2004
IATF16949:2016
IECQ QC 080000:2017
UL Certified
Product Images
Packaging & Delivery
Standard packaging includes PET film or foam protection, paper card layer separation, and export-grade cartons. Custom packaging available upon request. Lead time negotiable based on order quantity.
Technical Documentation
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai