Electrical Wires

1.5mmT UL Recognized 1.5W/MK thermal Conductive Gap Filler For Electronics 

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000 pcs
Delivery Time: 3-8 work days
Brand: Ziitek
Product Description

1.5mmT UL recognized 1.5W/MK Self Adhesive Hthermal conductive gap filler for Automotive electronics


Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

TIF100-05ES-Datasheet.pdf
 
The TIF160-05ES is an extremely soft gap filling material rated at a thermal conductivity of 1.5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF160-05ES is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
 
Features
<Good thermal conductive:1.5 W/mK
<Thickness:1.5mmT
<Hardness:12±5  Shore 00

<RoHS compliant

<UL recognized

<Fiberglass reinforced for puncture, shear and tear resistance

 
Applications

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

<LED Ceilinglamp

<Monitoring the Power Box

<AD-DC Power Adapters

<Rainproof LED Power


 

 
Typical Properties of TIF160-05ES
 
Product Name  
TIF160-05ESSeries
Colour
Blue
Construction & Compostion
Ceramic filled silicone rubber

Density

2.0 g/cm3

Thickness

1.5mmT
Hardness
12±5  Shore 00
Tensile Strength
40 psi
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
1.5 W/mK

 
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

Advantage

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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