CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Price:
0.1-10 USD/PCS
MOQ:
1000 pcs
Delivery Time:
3-8 work days
Brand:
Ziitek
Product Description
CPU Thermal Pad Thermal Interface Material Silicone Base With 3.0W/mK Thermal Conductivity For Cooling
Product Overview
The TIF®1200-30-11ES Series is a thermal pad specifically designed to tackle high-level cooling challenges and environments sensitive to extreme mechanical stress. It combines high thermal conductivity with near-fluid ultimate softness, ensuring perfect filling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and high heat flux electronic components.
Key Features
- Good thermal conductivity: 3.0W/mK
- Thickness: 5.0mm
- Hardness: 12 Shore 00
- Moldability for complex parts
- High tack surface reduces contact resistance
- Fiberglass reinforced for puncture, shear and tear resistance
Applications
- Power supply
- Heat pipe thermal solutions
- Memory Modules
- Mass storage devices
- IT infrastructure
- GPS navigation and other portable devices
- CD-Rom, DVD-Rom cooling
- New energy vehicle
- Motherboard chip
- Radiator
- AI Processors AI Servers
Technical Specifications of TIF®100-30-11ES
| Property | Value | Test Method |
|---|---|---|
| Color | Dark Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ****** |
| Density (g/cm³) | 3.15 | ASTM D792 |
| Thickness Range (inch/mm) | 0.020~0.030 (0.50~0.75) | 0.040~0.200 (1.00~5.00) | ASTM D374 |
| Hardness (Shore 00) | 12 | ASTM 2240 |
| Continuous Use Temp | -40 to 200℃ | *** |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 7.0 | ASTM D150 |
| Volume Resistivity | ＞1.0×10¹² Ohm-meter | ASTM D257 |
| Thermal Conductivity (W/m-K) | 3.0 | ASTM D5470 / ISO22007 |
| Fire rating | V-0 | UL 94 (E331100) |
Product Specifications
Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes:
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Company Advantages
Ziitek has an independent R&D team with experience, rigorous and pragmatic approach. They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we can also perform tests with customers' samples to find more suitable Ziitek materials for every customer.
Frequently Asked Questions
Q: Do you offer free samples?
A: Yes, we are willing to offer free samples.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai