Ziitek TIF1140-30-06UF Electrically Isolating Conductive Heat Sink Pad 3.5mm Thickness 3.0 W/mK Thermal Conductivity

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000 pcs
Delivery Time: 3-8 work days
Brand: Ziitek
Product Description
Product Overview
Ziitek TIF1140-30-06UF electrically isolating conductive heat sink pads are engineered for superior thermal management in electronic applications. These 3.5mm thick pads provide excellent heat transfer while maintaining electrical isolation between components.
Key Features
  • High thermal conductivity: 3.0 W/mK
  • Optimal thickness: 3.5mm
  • Electrical isolation properties
  • High durability and reliability
  • Easy release construction
  • White ceramic-filled silicone elastomer
Technical Specifications
Property Value
Product Name TIF1140-30-06UF Series
Color White
Construction & Composition Ceramic filled silicone elastomer
Specific Gravity 3.0 g/cc
Thickness 3.5mm
Hardness 75±5 Shore 00
Dielectric Constant @1MHz 5.0 MHz
Continuous Use Temperature -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal Conductivity 3.0 W/mK
Volume Resistivity 2.3*10¹³ Ohm-cm
Applications
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • CPU cooling solutions
  • Display card thermal management
Certifications
ISO9001:2015
ISO14001:2004
IATF16949:2016
IECQ QC 080000:2017
UL Certified
Documentation
Ziitek TIF1140-30-06UF thermal conductive pad product image Ziitek thermal interface materials manufacturing and quality control process

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Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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