TIS580-12 Thermal Conductive Silicone Adhesive for LED - 1.2W/mK Conductivity, 5000 cps Viscosity
TIS™580-12 Series is a dealcoholized, single-component, room temperature cure thermally conductive silicone adhesive designed for LED applications. This adhesive provides excellent heat conduction and strong adhesion to electronic components, forming a high-hardness elastomer that minimizes thermal impedance for efficient heat transfer between heat sources, heat sinks, motherboards, and metal casings.
- Thermal conductivity: 1.2W/mK
- Excellent electrical insulation properties
- Low viscosity for void-free surface application
- Good adhesion to copper, aluminum, and stainless steel
- Low shrinkage and longer working life
- Excellent thermal shock resistance
- Good solvent and water resistance
- UL94 V-0 flame retardant rating
| Parameter | Value | Test Method |
|---|---|---|
| Appearance | White paste | Visual |
| Density (g/cm³, 25℃) | 1.2 | ASTM D297 |
| Viscosity @25℃ Brookfield (Uncured) | 5000 cps | ASTM D1084 |
| Hardness (Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength (MPa) | ≥2.0 | ASTM D1876 |
| Thermal Conductivity W/(m*K) | 1.2 | ASTM D5470 |
| Operation Temperature (℃) | -60 to 250 | Standard Test |
| Volume Resistivity (Ω*cm) | 2.0×10¹⁶ | ASTM D257 |
Ideal for replacing thermal pastes and pads in gap-filling applications between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Suitable for integrated circuits in portable computers, microprocessors, high-power LEDs, internal storage modules, DC/AC translators, IGBT and other power modules, semiconductor encapsulation, relay switches, rectifiers, and transformers.
Available in 300ml tubes for convenient application and storage.
Our commitment to quality includes total quality control, competitive thermal interface materials, confidentiality agreements, free sample offerings, and quality assurance contracts.
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