Chemicals Adhesives & Sealants

TIE280-12AB High Temperature Waterproof Epoxy Glue - 1.2W/mK Thermal Conductivity, 160℃ Operating Range

Price Negotiable
Price: 1-100USD/kg
MOQ: 10kg
Delivery Time: 3-8 work days
Brand: Ziitek
Product Description
Product Overview

TIE™280-12AB is a two-component, high thermal conductivity epoxy encapsulant compound featuring low-temperature curing, extended pot life, and fire-resistant properties. Specifically engineered for capacitor and electrical device potting applications.

High temperature waterproof epoxy glue for electronic components
Key Features
  • Excellent thermal conductivity: 1.2W/mK
  • Superior insulation properties with smooth surface finish
  • Minimal shrinkage during curing
  • Low viscosity for efficient air release
  • Exceptional solvent resistance and waterproof performance
  • Extended operational lifetime
  • Outstanding thermal shock efficiency and impact resistance
Application Areas
  • Automotive starters potting and general potting applications
  • Thermal detector potting and ferrite adhesion
  • TIP type LED applications with strong adhesion to aromatic polyester
  • Relay sealant with excellent bonding to rubber, ceramics, PCB and plastics
  • Power transformers, coils, and capacitor potting
  • Small electrical device encapsulation
  • Metal, glass, and plastic adhesion
  • LCD & substrates bonding, coating and sealant applications
  • Coil, IGBT, transformer encapsulation with fire retardant properties
  • Optical and medical component adhesive applications
Technical Specifications
Typical Uncured Material Properties
TIE™280-12A (Resin) ColorBlack
TIE™280-12A Viscosity @25℃15000 cPs
TIE™280-12B (Hardener) Viscosity @25℃7000 cPs
Mixing Ratio (Weight)A:B = 1:1
Operating Time @25℃45 minutes
Shelf Life @25℃12 months
Specific Gravity1.6 g/cc
Cured Material Properties
Hardness @25℃85 Shore D
Operating Temperature Range-40℃ to 160℃
Glass Transition Temperature (Tg)92℃
Thermal Conductivity1.2 W/m-K
Fire Resistance UL Rating94 V-0
Dielectric Breakdown Voltage300 volts/mil
Volume Resistivity @25℃3.0 × 10¹³ ohm-cm
Packaging Options

Available in multiple packaging configurations:

  • 1kg per can
  • 5kg A/B components each
  • 10kg A/B components each
Industrial epoxy glue packaging and manufacturing
Manufacturer Profile

Ziitek Electronic Material and Technology Ltd. is a specialized R&D and production company with extensive expertise in thermal conductive materials. We maintain advanced production equipment and optimized processes to deliver comprehensive thermal solutions for diverse industrial applications.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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