1.5W/mK Thermal Conductive Potting Adhesive - 1KG Dual Component with UL 94 V-0 Fire Resistance for Electronics

Price Negotiable

Price: USD 1-50 / can

MOQ: 5can

Delivery Time: 3-7 work days

Brand: Ziitek

Product Description

Product Overview

TIS™680-15AB is a two-component thermal conductive potting adhesive designed for electronic component encapsulation. This 1.5W/mK thermal conductivity adhesive features low temperature curing, long pot life, and UL 94 V-0 fire resistance certification.

Technical Datasheet

Key Features

Thermal conductivity: 1.5W/mK
Excellent insulation and smooth surface finish
Low shrinkage and viscosity for easy air release
Superior solvent resistance and waterproof properties
Extended component lifetime with excellent thermal shock efficiency
Impact resistance for durable electronic protection

TIS680-15AB thermal conductive potting adhesive product image showing application in electronic components

Applications

LED lighting heat spreaders and power drivers
Ferrite cements and tip-type LED applications
Relay sealants with adhesion to rubber, ceramics, PCB, and plastics
Power transformers, coils, and capacitor potting
Small electrical device encapsulation
LCD & substrate adhesion and coating sealants
IGBTs, transformers, and optical/medical components

Technical Specifications

Property	Value
Thermal Conductivity	1.5W/m-K
Operating Temperature	-40℃ to 160℃
Hardness (Shore A)	85 Shore D
Glass Transition Temperature	92℃
Fire Resistance	UL 94 V-0
Dielectric Strength	400 volts/mil
Volume Resistivity	3.0×10¹³ ohm-cm
Mixing Ratio (Weight)	A:B = 100:100
Working Pot Life (250g @25℃)	30 minutes

Packaging Options

1KG A/B components per tank
5KG A/B components
10KG A/B components

1.5W/mK two-component thermal conductive adhesive application in LED panel light potting

Manufacturer Information

Ziitek Electronic Material and Technology Ltd. is a specialized R&D and production company with advanced manufacturing equipment and optimized processes for thermal conductive materials.