TIC®800K Series Phase Change Material - 1.6 W/mK Thermal Conductivity, 0.005-0.008 inch Thickness for CPU and Power Equipment
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-6 work days
Brand:
Ziitek
Product Description
TIC®800K Series is a high thermal conductivity and high dielectric constant insulating pad designed for power conversion equipment and electronic components. It consists of a polyimide film substrate coated with a low-melting-point phase change material filled with ceramic blend. At 50°C, the material surface begins to soften and flow, effectively filling microscopic surface irregularities between the heat sink and integrated circuit board, thereby reducing thermal resistance and enhancing heat transfer efficiency.
Key Features
- Soft surface with excellent heat conductivity
- High dielectric strength for electrical insulation
- Low thermal resistance for efficient heat transfer
- Anti-tear and anti-puncture properties
Applications
- Power conversion equipment
- Power semiconductors, MOSFETs, and IGBTs
- Audio and video components
- Automotive control units
- Motor controllers
- General high voltage interface applications
Technical Specifications
| Property | TIC®805K | TIC®806K | TIC®808K | Test Method |
|---|---|---|---|---|
| Composite Thickness | 0.004"/0.102mm | 0.005"/0.127mm | 0.006"/0.152mm | ASTM D374 |
| MT Kapton® Thickness | 0.001"/0.0254mm | 0.001"/0.0254mm | 0.002"/0.0508mm | ASTM D374 |
| Total Thickness | 0.005"/0.127mm | 0.006"/0.152mm | 0.008"/0.203mm | ASTM D374 |
| Thermal Conductivity | 1.6 W/mK (ASTM D5470) | |||
| Thermal Impedance @50psi | 0.12°C*in²/W | 0.13°C*in²/W | 0.16°C*in²/W | ASTM D5470 |
| Dielectric Breakdown Voltage | >5000 VAC (ASTM D149) | |||
| Operating Temperature | -45°C to 125°C | |||
Standard Specifications
Thickness Options: 0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm) - Custom thicknesses available upon request
Standard Size: 10" x 100' (254mm x 30M) - Individual die cut shapes available
Reinforcement: Polyimide film for enhanced durability
Manufacturer Profile
Ziitek is a specialized manufacturer of thermal interface materials including thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive interface pads, thermal grease, thermal conductive plastic, silicone rubber, silicone foams, and phase changing materials. With well-equipped testing facilities and strong technical capabilities, we ensure product quality and performance.
Quality Assurance
- "Do it right the First time, total quality control" philosophy
- Core competency in thermal conductive interface materials
- Competitive advantage products with confidentiality agreements
- Free sample program available
- Comprehensive quality assurance contracts
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer based in China with full production capabilities.
How do I request customized samples?
Contact us through our website messaging system, email, or phone to request samples tailored to your specific requirements.
What's the thermal conductivity test method given on the data sheet?
All data is actual tested using Hot Disk and ASTM D5470 methods to ensure accuracy and reliability.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai