Carbon Nano Composite Copper Foil Thermal Graphite Sheet 700W/mK 0.040-0.080mm for Smartphone Heat Sink
High-performance thermal management solution designed for smartphone heat dissipation and electronic cooling applications.
- Exceptional thermal conductivity: 700 W/mK in X-Y axis
- Effective EMI shielding capabilities
- Ultra-thin design with thickness options from 0.040mm to 0.080mm
- Lightweight, non-toxic, and environmentally friendly
- RoHS compliant with low thermal resistance
- Wide operating temperature range: -40℃ to 400℃
- Smartphones and mobile devices
- Display cards and motherboards
- Notebook computers and power supplies
- Memory modules and storage devices
- Automotive electronics and heat pipe solutions
| Parameter | TIR™340C-T2 | TIR™360-C-T2 | TIR™380-C-T2 | Test Method |
|---|---|---|---|---|
| Total Thickness | 0.040 mm | 0.060 mm | 0.080 mm | ASTM D751 |
| Copper Foil Thickness | 0.038 mm | 0.057 mm | 0.077 mm | ASTM D751 |
| Thermal Conductivity (X-Y axis) | 700 W/m-K | 700 W/m-K | 700 W/m-K | ASTM D5470 |
| Thermal Resistance @100psi | 0.065 in²℃/W | 0.079 in²℃/W | 0.092 in²℃/W | ASTM D5470 |
| Tensile Strength | 30 psi | 35 psi | 40 psi | ASTM D412 |
Standard sheet size: 500mm x 200m. Custom die-cut shapes and alternate thickness options available upon request.
Manufactured under ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, and UL standards.
We are a manufacturer based in China with extensive experience in thermal interface materials.
Standard delivery: 3-7 working days for in-stock items, 7-10 working days for custom orders based on quantity.
Yes, we offer free samples for evaluation purposes.
Contact our technical team with your specific application details and power requirements for personalized recommendations.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.