TIS580-12 Dealcoholized Thermally Conductive Silicone Adhesive - 1.2W/mK Thermal Conductivity, 25 Shore A Hardness
Price:
1-100USD/KG
MOQ:
10kg
Delivery Time:
3-8 work days
Brand:
Ziitek
Product Description
Product Overview
TIS™580-12 Series is a dealcoholized, one-component thermally conductive silicone adhesive that cures at room temperature to a 25 Shore A hardness. This adhesive provides excellent heat conduction and strong adhesion for electronic components.
Key Features
- Thermal conductivity: 1.2W/mK
- Room temperature curing with 25 Shore A hardness
- Excellent electrical insulation properties
- Dealcoholized formulation prevents metal corrosion
- Low viscosity for void-free application
- Good solvent and water resistance
- UL94 V-0 flame retardant rating
- Operating temperature range: -60°C to 250°C
Technical Specifications
| Parameter | Value | Test Method |
|---|---|---|
| Appearance | White paste | Visual |
| Density (g/cm³, 25°C) | 1.2 | ASTM D297 |
| Viscosity @25°C Brookfield | 5000 cps | ASTM D1084 |
| Hardness (Shore A) | 25 | ASTM D2240 |
| Thermal Conductivity W/(m·K) | 1.2 | ASTM D5470 |
| Volume Resistivity (Ω·cm) | 2.0×10¹⁶ | ASTM D257 |
| Operation Temperature | -60°C to 250°C | Standard Test |
| Flame Retardancy | UL94 V-0 | E331100 |
Applications
Ideal for replacing thermal paste and pads in gap-filling applications between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Suitable for integrated circuits in portable computers, microprocessors, high-power LEDs, internal storage modules, DC/AC translators, IGBT and other power modules.
Documentation
Product Images
Packaging
Available in 300ml tubes for convenient application and storage.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai