TIS580-10 Dealcoholized Thermally Conductive Silicone Adhesive - 1.0W/mK Thermal Conductivity, 30K cps Viscosity
TIS™580-10 Series is a dealcoholized, one-component, room temperature cure thermally conductive silicone adhesive designed for electronic component applications. This advanced material provides excellent heat conduction and adhesion properties, curing to a high-hardness elastomer that firmly attaches to substrates for minimal thermal impedance.
The dealcoholized formulation ensures non-corrosive performance, particularly on metal surfaces including copper, aluminum, and stainless steel. With high thermal conductivity of 1.0W/mK and excellent electrical insulation, this ready-to-use adhesive enables efficient heat transfer between heat sources, heat sinks, motherboards, and metal casings.
- Thermal conductivity: 1.0W/mK
- Excellent adhesion to various metal substrates
- Low shrinkage and viscosity for void-free surfaces
- Good solvent and water resistance
- Long working life and excellent thermal shock resistance
- Dealcoholized system prevents metal corrosion
Primarily used as a replacement for thermal paste and pads in gap-filling applications between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Replaces traditional mechanical fastening methods with more reliable thermal conduction, simplified handling, and cost-effectiveness.
Applications include integrated circuits in portable computers, microprocessors, high-power LEDs, internal storage modules, cache systems, DC/AC translators, IGBT and power modules, semiconductor encapsulation, relay switches, rectifiers, and transformers.
| Parameter | Value | Test Method |
|---|---|---|
| Appearance | White paste | Visual |
| Density (g/cm³, 25℃) | 1.3 | ASTM D297 |
| Tack-free time (min, 25℃) | ≤20 | Internal Method |
| Viscosity @25℃ Brookfield (Uncured) | 30K cps | ASTM D1084 |
| Total cure time (days, 25℃) | 3-7 | Internal Method |
| Hardness (Shore A) | 45 | ASTM D2240 |
| Lap Shear Strength (MPa) | ≥2.5 | ASTM D1876 |
| Operation temperature (℃) | -60~250 | Internal Method |
| Volume Resistivity (Ω-cm) | 2.0×10¹⁵ | ASTM D257 |
| Thermal Conductivity W/(m·K) | 1.0 | ASTM D5470 |
| Flame Retardancy | UL94V-0 | E331100 |
Packaging: 100ml per piece, 100 pieces per box; 300ml per piece, 24 pieces per box
Storage: Store in cool, dry place. Shelf life: 6 months at 25℃
Transportation: This product is non-hazardous and follows local general chemical transportation regulations.
Ziitek is a high-tech enterprise specializing in the research, development, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience in thermal management solutions, we provide advanced products including thermal silicone pads, thermal graphite sheets, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, and thermal grease. All products comply with UL94 V-0, SGS, and ROHS standards.
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