TIS580-10 Dealcoholized Thermally Conductive Silicone Adhesive - 1.0W/mK Thermal Conductivity, 30K cps Viscosity

Price Negotiable
Price: USD 1-50 / can
MOQ: 5can
Delivery Time: 3-7 work days
Brand: Ziitek
Product Description
Product Overview

TIS™580-10 Series is a dealcoholized, one-component, room temperature cure thermally conductive silicone adhesive designed for electronic component applications. This advanced material provides excellent heat conduction and adhesion properties, curing to a high-hardness elastomer that firmly attaches to substrates for minimal thermal impedance.

The dealcoholized formulation ensures non-corrosive performance, particularly on metal surfaces including copper, aluminum, and stainless steel. With high thermal conductivity of 1.0W/mK and excellent electrical insulation, this ready-to-use adhesive enables efficient heat transfer between heat sources, heat sinks, motherboards, and metal casings.

Key Features
  • Thermal conductivity: 1.0W/mK
  • Excellent adhesion to various metal substrates
  • Low shrinkage and viscosity for void-free surfaces
  • Good solvent and water resistance
  • Long working life and excellent thermal shock resistance
  • Dealcoholized system prevents metal corrosion
Applications

Primarily used as a replacement for thermal paste and pads in gap-filling applications between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Replaces traditional mechanical fastening methods with more reliable thermal conduction, simplified handling, and cost-effectiveness.

Applications include integrated circuits in portable computers, microprocessors, high-power LEDs, internal storage modules, cache systems, DC/AC translators, IGBT and power modules, semiconductor encapsulation, relay switches, rectifiers, and transformers.

Technical Specifications
Parameter Value Test Method
Appearance White paste Visual
Density (g/cm³, 25℃) 1.3 ASTM D297
Tack-free time (min, 25℃) ≤20 Internal Method
Viscosity @25℃ Brookfield (Uncured) 30K cps ASTM D1084
Total cure time (days, 25℃) 3-7 Internal Method
Hardness (Shore A) 45 ASTM D2240
Lap Shear Strength (MPa) ≥2.5 ASTM D1876
Operation temperature (℃) -60~250 Internal Method
Volume Resistivity (Ω-cm) 2.0×10¹⁵ ASTM D257
Thermal Conductivity W/(m·K) 1.0 ASTM D5470
Flame Retardancy UL94V-0 E331100
Packaging & Storage

Packaging: 100ml per piece, 100 pieces per box; 300ml per piece, 24 pieces per box

Storage: Store in cool, dry place. Shelf life: 6 months at 25℃

Transportation: This product is non-hazardous and follows local general chemical transportation regulations.

Documentation

TIS580-10 thermally conductive silicone adhesive product sample and application examples
Manufacturer Information

Ziitek is a high-tech enterprise specializing in the research, development, manufacturing, and sales of thermal interface materials (TIMs). With extensive experience in thermal management solutions, we provide advanced products including thermal silicone pads, thermal graphite sheets, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, and thermal grease. All products comply with UL94 V-0, SGS, and ROHS standards.

Ziitek manufacturing facility and production equipment for thermal interface materials

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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