Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs
Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs
Products Discription
TIF®100-65-11ES Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of theheat-generating electroniccomponents.
Features
>Excellent thermal conductivity: 6.5 W/mK
>Naturally tacky needing no further adhesive coating
>High compliance adapts to various pressure application environments
>Available in different thickness options
Applications
>Heat dissipation structure for radiators
>Telecommunication equipment
>Automotive electronics
>Battery packs for electric vehicles
>LED TV and lamps
| Typical Properties of TIF®100-65-11ES Series | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | *** |
| Thickness range | 0.02~0.20inch(0.50~5.0mm) | ASTM D374 |
| Hardness | 12 Shore 00 | ASTM 2240 |
| Density | 3.4 g/cc | ASTM D792 |
| Recommended Operating Temp | -40 ~ 200℃ | Ziitek Test Method |
| Breakdown Voltage(V/mm) | >5500 | ASTM D149 |
| Dielectric Constant @1MHz | 7.0 MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X1012Ohm-cm | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 6.5W/m-K | ASTM D5470 |
Product Specifications
Standard Thickness: 0.02" (0.50 mm)-0.20" (5.00 mm) with increments of 0.01" (0.25 mm).
Standard Size: 16" X16" (406 mmX 406 mm).
Component Codes:
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Independent R&D team
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