Thermal Gap Filler Silicone Pads Custom Size High Thermal Conductivity 8.5W/mK For Cooling Of Electronic Devices
TIF®700RES Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation fins or metal bases. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from heat-generating electronic components, thereby enhancing efficiency and lifespan.
- Excellent thermal conductivity: 8.5 W/mK
- Naturally tacky - no additional adhesive required
- High compliance adapts to various pressure application environments
- Available in different thickness options
- Easy release construction
- Electrically isolating
- Heat dissipation structure for radiators
- Telecommunication equipment
- Automotive electronics
- Battery packs for electric vehicles
- LED TV and lamps
- Display card
- Mainboard/mother board
- Notebook
- Power supply
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | *** |
| Thickness range | 0.04~0.12inch / 1.0~3.0mm | ASTM D374 |
| Hardness | 10 Shore 00 | ASTM 2240 |
| Specific Gravity | 3.5 g/cc | ASTM D792 |
| Continuous Use Temp | -40 to 200℃ | Ziitek Test Method |
| Dielectric Breakdown Voltage | ≥5000 VAC | ASTM D149 |
| Dielectric Constant | 6.7 MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹² Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 8.5W/m-K | ASTM D5470 |
Packaging includes PET film or foam for protection, paper card separation between layers, and export cartons. Customized packaging available upon request.
Lead Time: 5000 pieces - To be negotiated
ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
A: We are manufacturer in China.
A: All data in the sheet are actual tested. Hot Disk and ASTM D5470 are utilized to test thermal conductivity.
A: It depends on the watts of power source and heat dissipation ability. Please provide detailed application information and power requirements for suitable thermal conductive material recommendations.
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