Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink
Thermal Gap Filler With Low Volatility Silicone And Ceramic Fillers To Optimize Heat Transfer Between Electronic Components And Heatsink
Company Profile
Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
The TIF®100L 3030-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices.Balances efficient thermal conductivity and extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits. And the material has excellent flexibility and elasticity, which can fully fill the micro gaps between the heating interface and the heat dissipation structure, significantly reduce the contact thermal resistance,improve the thermal conductivity efficiency, and ensure the reliability and service life of electronic components in long-term operation.
> Good thermal conductivity
> Excellent weather resistance and aging resistance
> Highly compressible, easy to install and operate
> Good insulation performance
> Airborne computer
> Machine vision camera
> High performance ASIC chip
> Central control screen
| Typical Properties of TIF®100L 3030-06 Series | |||
| Property | Value | Test method | |
| Color | White | Visual | |
| Construction | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| 0.25~0.50 | 0.75~5.00 | ||
| Hardness ( Shore 00) | 65 | 30 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Volume Resistivity(Ohm-meter) | ＞1.0X1012 | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity(W/m-K) | 3.0 | ASTM D5470 | |
| 3.0 | ISO22007 | ||
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm),with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmx406 mm)
The TIF® series is available in custom shapes andvarious forms.
For other thicknesses or more information, please contact us.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.