Chemicals Adhesives & Sealants

TIE™380-25 Thermal Conductive Epoxy Adhesive - 2.5W/mK Conductivity, 92 Shore A Hardness for Electronics Bonding

Price Negotiable
Price: 1-100USD/kg
MOQ: 10kg
Delivery Time: 3-8 work days
Brand: Ziitek
Product Description
TIE™380-25 High Performance Thermal Conductive Epoxy Adhesive
Product Overview

TIE™380-25 is a silicone-based, thermally conductive gap pad featuring unreinforced construction for enhanced compliancy. This electrically isolating product offers low hardness, excellent conformability, and optimal thermal performance with easy handling characteristics.

Key Features
  • Outstanding thermal performance: 2.5W/mK thermal conductivity
  • High tack surface reduces contact resistance
  • RoHS compliant and UL recognized
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Easy release construction
Applications
  • Heat pipe thermal solutions
  • Memory Modules and mass storage devices
  • Automotive electronics
  • Set top boxes and audio/video components
  • IT infrastructure and GPS navigation devices
  • Portable electronic devices
Technical Specifications
Property Value Test Method
Chemical Type Epoxy -
Appearance (uncured) Gray Paste Visual
Appearance (cured) Dull Gray Solid Visual
Heat Capacity 0.7 J/g-K ASTM C351
Hardness 92 Shore A ASTM 2240
Continuous Use Temperature -40 to 180℃ -
Tensile Strength (Al/Al @25°C) >2800 psi -
Thermal Conductivity 2.5 W/m-K ASTM D5470
Application Properties
  • Color: Gray
  • Viscosity @25℃: 140,000 cPs
  • Specific Gravity @25℃: 2.1 g/cc
  • Shelf Life: 10 days @25℃ / 6 months @0℃
Curing Procedures
Curing Temperature Curing Time
100℃ 3 Hours
125℃ 1.5 Hours
150℃ 20 Minutes
170℃ 5 Minutes
Packaging

Available in 1kg cans for convenient handling and storage.

TIE™380-25 Thermal Conductive Epoxy Glue product packaging and application example

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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