TIS580-12 Dealcoholized Thermally Conductive Silicone Adhesive - 1.2W/mK Thermal Conductivity, 20K cps Viscosity
Price:
1-100USD/KG
MOQ:
10kg
Delivery Time:
3-8 work days
Brand:
Ziitek
Product Description
Product Overview
TIS™580-12 Series is a dealcoholized, one-component, room temperature cure thermally conductive silicone adhesive designed for electronic component bonding and heat management applications.
Key Features
- Thermal conductivity: 1.2W/mK for efficient heat transfer
- Dealcoholized formulation prevents metal corrosion
- Room temperature curing with 3-7 day full cure time
- Excellent adhesion to copper, aluminum, and stainless steel
- Low viscosity (20K cps) for void-free application
- UL94 V-0 flame retardant rating
- Operating temperature range: -60°C to 250°C
- Good solvent and water resistance
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Appearance | White paste | Visual |
| Density (g/cm³, 25°C) | 1.2 | ASTM D297 |
| Viscosity @25°C Brookfield | 20K cps | ASTM D1084 |
| Hardness (Shore A) | 25 | ASTM D2240 |
| Thermal Conductivity W/(m*K) | 1.2 | ASTM D5470 |
| Volume Resistivity (Ω*cm) | 2.0×10¹⁶ | ASTM D257 |
| Dielectric Strength (KV/mm) | 21 | ASTM D149 |
Applications
Ideal for replacing thermal pastes and pads in gap-filling applications between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Suitable for integrated circuits in portable computers, microprocessors, high-power LEDs, internal storage modules, DC/AC translators, IGBT and other power modules.
Documentation & Media
Packaging
300ml per tube, 24 tubes per box
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai