TIF200-02E Thermal Conductive Silicone Pad 1.25 W/mK 0.5-5mm Thickness for CPU GPU Cooling
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIF™200-02E Series Thermal Conductive Silicone Pads
Thermally conductive interface materials designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates to enhance the efficiency and lifespan of heat-generating electronic components.
Key Features
- Excellent thermal conductivity: 1.25 W/mK
- Naturally tacky surface requiring no additional adhesive coating
- Soft and compressible for low-stress applications
- Available in various thicknesses from 0.5mm to 5.0mm
Applications
- Cooling components to chassis or frame
- High-speed mass storage drives
- Automotive engine control units
- Telecommunication hardware
- Handheld portable electronics
- Semiconductor automated test equipment (ATE)
- CPU cooling systems
- Display card thermal management
- Motherboard heat dissipation
- Notebook computer thermal solutions
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Color | Gray / White | Visual |
| Construction | Ceramic filled silicone elastomer | - |
| Thermal Conductivity | 1.25 W/mK | ASTM D5470 |
| Hardness | 35 Shore 00 | ASTM 2240 |
| Specific Gravity | 2.2g/cc | ASTM D297 |
| Thickness Range | 0.020"-0.200" (0.5mm-5.0mm) | ASTM D374 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.0MHz | ASTM D150 |
| Volume Resistivity | 1.0×10¹² Ohm-meter | ASTM D257 |
| Continuous Use Temperature | -40 to 160°C | - |
| Outgassing (TML) | 0.35% | ASTM E595 |
| Flame Rating | 94 V0 | UL E331100 |
Available Thickness Options
- 0.010" (0.25mm) to 0.200" (5.08mm) in 0.010" increments
- Consult factory for alternate thickness requirements
Standard Sheet Sizes & Options
- Standard sheet size: 8" x 16" (203mm x 406mm)
- Individual die-cut shapes available upon request
- Pressure sensitive adhesive options: one side (A1 suffix) or double side (A2 suffix)
- Fiberglass reinforcement available for TIF™ series sheets
Packaging & Quality Assurance
Thermal pads are protected with PET film or foam, separated by paper card layers, and packed in export-grade cartons. Customized packaging available to meet specific customer requirements.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai