TIF500S Series 3.2W/mK Thermal Conductive Gap Filler Pads 0.5-5.0mm Thickness Range

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description
TIF500S Series Thermal Conductive Gap Filler Pads
High-performance 3.2W/mK thermal interface materials designed to fill air gaps between heat-generating components and heat dissipation surfaces. These flexible, compressible pads effectively transfer heat to metal housings or cooling plates, enhancing thermal efficiency and extending the lifespan of electronic devices.
Key Features
  • Excellent thermal conductivity (3.2 W/mK)
  • Soft and compressible for low stress applications
  • RoHS compliant and UL recognized
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Continuous operating temperature range: -40°C to 160°C
Applications
  • CPUs and display cards
  • Motherboards and notebooks
  • Power supplies and memory modules
  • Mass storage devices and automotive electronics
  • Set-top boxes and audio/video components
  • Heat pipe thermal solutions
Technical Specifications
PropertyValueTest Method
Thermal Conductivity3.2 W/mKASTM D5470
Hardness45 Shore 00ASTM 2240
Specific Gravity3.0 g/ccASTM D297
Thickness Range0.020"-0.200" (0.5mm-5.0mm)ASTM D374
Dielectric Breakdown Voltage>5500 VACASTM D149
Volume Resistivity1.0×10¹² Ohm-meterASTM D257
Continuous Use Temperature-40°C to 160°C-
Flame Rating94-V0UL E331100
Available Thickness Options
0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm), 0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm), 0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm), 0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm), 0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm)
Standard Sheet Sizes
8" × 16" (203mm × 406mm) and 16" × 18" (406mm × 457mm)
Customization Options
  • Individual die-cut shapes available
  • Pressure sensitive adhesive options: one-side (A1 suffix) or double-side (A2 suffix)
  • Fiberglass reinforcement available for sheet types
TIF500S Series Thermal Conductive Gap Filler Pads product image showing blue thermal interface material
Manufacturer Quality Assurance
Ziitek is a certified manufacturer of thermal management solutions with ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, and UL certifications.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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