TIF600P Series 6.0 W/m-K Thermally Conductive Silicone Pad | 0.25mm to 5.08mm Thickness Options
The TIF600P Series is an extremely soft thermally conductive silicone gap filler with 6.0 W/m-K thermal conductivity, specifically formulated for high-performance applications requiring low assembly stress. This ceramic-filled silicone rubber material offers exceptional thermal performance at low pressures and is highly conformal to rough or irregular surfaces.
- High thermal conductivity: 6.0 W/m-K
- Excellent moldability for complex parts
- Soft and compressible for low stress applications
- Naturally tacky surface requiring no additional adhesive
- Available in multiple thicknesses from 0.25mm to 5.08mm
- UL 94 V-0 fire rating equivalent
- Cooling components to chassis or frame
- High-speed mass storage drives
- LED TV and LED-lit lamps heat sinking
- LCD backlight units
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
- Telecommunication hardware
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 6.0 W/m-K | ASTM D5470 |
| Specific Gravity | 3.0 g/cc | ASTM D297 |
| Hardness | 50 Shore 00 | ASTM 2240 |
| Continuous Use Temperature | -40°C to 160°C | - |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Fire Rating | 94 V0 equivalent | UL |
Standard thicknesses range from 0.010" (0.25mm) to 0.200" (5.08mm) in 0.010" increments. Consult factory for alternate thickness options.
- 8" x 16" (203mm x 406mm)
- 16" x 18" (406mm x 457mm)
- Custom die-cut shapes available upon request
- Pressure sensitive adhesive: single side (A1 suffix) or double side (A2 suffix)
- Fiberglass reinforcement available
- Custom dimensions, shapes, and colors
Ziitek maintains an experienced R&D team with well-equipped testing facilities to provide customized thermal solutions. Free samples available for evaluation.
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