TIC®800K Series is a high thermal conductivity and high dielectric constant insulating pad designed for electronic modules. The material consists of a polyimide film substrate coated with a low-melting-point phase change material filled with ceramic blend. At 50°C, the material surface begins to soften and flow, effectively filling microscopic surface irregularities between the heat sink and integrated circuit board, reducing thermal resistance and enhancing heat transfer efficiency.

• Soft surface with excellent heat conductivity
• Superior dielectric strength and high-voltage insulation
• Low thermal resistance for efficient heat transfer
• Anti-tear and anti-puncture properties

• Power conversion equipment
• Power semiconductors, MOSFETs, and IGBTs
• Audio and video components
• Automotive control units
• Motor controllers
• General high voltage interfaces

Standard Thicknesses: 0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm) - Custom thicknesses available upon request

Standard Sizes: 10" x 100' (254mm x 30M) - Individual die cut shapes can be supplied

Reinforcement: Polyimide film reinforced construction

Packaging: Protected with PET film or foam, paper card separation between layers, export carton packaging, customized options available

Lead Time: 3-5 working days for quantities up to 5000 pieces - Contact for larger quantity delivery schedules

Ziitek Electronic Material and Technology Ltd. is a specialized R&D and production company with multiple production lines and advanced processing technology for thermal conductive materials. We provide comprehensive thermal solutions for various applications with optimized manufacturing processes.