The TIG™780-50 series represents high-efficiency thermal interface materials designed specifically for filling gaps between electronic components and heat dissipation fins. These products thoroughly wet contact surfaces to create interfaces with extremely low thermal impedance, delivering superior heat dissipation performance compared to conventional solutions.

• Low thermal impedance for superior heat transfer
• Non-toxic and environmentally safe formulation
• Excellent long-term stability and reliability
• Thoroughly wets contact surfaces to minimize thermal resistance

• Custom power modules
• Telecommunications and automotive electronics
• LED power supplies and controllers
• LED lighting systems and ceiling lamps
• Monitoring and power box applications

Available in 0.5kg, 1kg, and 2kg packaging specifications. Custom packaging options available upon request.

Store at temperatures between 5°C and 25°C with maximum humidity of 70%. Do not freeze below 0°C. Keep in low temperature, dry conditions away from open flames and direct sunlight. Refer to product material safety data sheet for detailed handling instructions.

Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to serve as your reliable thermal management partner.