TIF120-02F Thermal Conductive Silicone Pad 1.5W/mK 60 Shore 00 for Electronics Heat Dissipation
The TIF120-02F Series thermal conductive silicone pads are engineered to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity enable effective contact with uneven surfaces, transferring heat from individual components or entire PCBs to metal housings or dissipation plates, thereby enhancing the efficiency and lifespan of heat-generating electronic devices.
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 1.5 W/mK | ASTM D5470 |
| Hardness | 60 Shore 00 | ASTM 2240 |
| Continuous Use Temperature | -40°C to 160°C | - |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Fire Rating | 94 V0 (UL equivalent) | - |
| Specific Gravity | 2.3 g/cc | ASTM D297 |
- Excellent thermal conductivity: 1.5 W/mK
- Broad range of hardness options available
- Moldable for complex component shapes
- Superior thermal performance characteristics
- Available thickness range: 0.020" - 0.200" (0.51mm - 5.08mm)
- CPU cooling systems
- Display card thermal management
- Motherboard and mainboard applications
- Notebook computer heat dissipation
- Power supply thermal solutions
- Heat pipe integration
- Memory modules
- Mass storage devices
Available in 20 standard thicknesses from 0.010" (0.25mm) to 0.200" (5.08mm). Custom thicknesses available upon request.
All products comply with UL94 V-0, SGS, and ROHS standards. Manufactured with full quality control processes and advanced production equipment.
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