TIF160-02F Notebook Thermal Gap Filler Pad 1.5W/m-K with Natural Tackiness in 0.020-0.200 Inch Thickness Range
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
Product Overview
The TIF160-02F Series is a silicone-based thermally conductive gap filler pad designed for notebook and electronic applications. With 1.5W/m-K thermal conductivity and natural tackiness requiring no additional adhesive, this thermal interface material provides excellent heat dissipation while simplifying installation.
Key Features
- Excellent thermal conductivity (1.5W/m-K)
- Naturally tacky surface eliminates need for adhesive coating
- Soft and compressible for low-stress applications
- Moldable for complex parts and tight spaces
- Available in various thicknesses from 0.020" to 0.200"
- UL 94 V0 fire rating for safety compliance
- Broad hardness range with 60 Shore 00 rating
- Electrically isolating properties
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 1.5W/m-K | ASTM D5470 |
| Thickness Range | 0.020" - 0.200" (0.51mm - 5.08mm) | ASTM C351 |
| Hardness | 60 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Operating Temperature | -45°C to 200°C | - |
| Volume Resistivity | 1.0×10¹² Ohm-meter | ASTM D257 |
| Fire Rating | 94 V0 | UL equivalent |
Available Thickness Options
Standard thicknesses include: 0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm), 0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm), 0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm), 0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm), 0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm). Custom thicknesses available upon request.
Standard Sheet Sizes
8" × 16" (203mm × 406mm). Individual die-cut shapes can be supplied to meet specific application requirements.
Adhesive Options
Available with pressure-sensitive adhesive: A1 suffix for single-side adhesive, A2 suffix for double-side adhesive.
Reinforcement Options
Fiberglass reinforcement available for enhanced structural integrity in demanding applications.
Application Areas
- Notebook and laptop cooling systems
- LED TVs and lighting applications
- Telecommunication hardware
- Automotive engine control units
- Portable electronics and handheld devices
- CPU and display card thermal management
- Memory modules and storage drives
- Semiconductor test equipment
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai