1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application
The TIF®100-10-01U Series thermal gap filler pads utilize a specialized manufacturing process with silicone as the base material, incorporating thermal conductive powder and flame retardant additives to create an effective thermal interface material. This formulation significantly reduces thermal resistance between heat sources and heat sinks.
- Handheld portable electronics
- Semiconductor automated test equipment (ATE)
- CPU cooling solutions
- Display card thermal management
- Mainboard/motherboard applications
- Home appliance industry
- Power module thermal regulation
- Wearable device thermal control
- Solar photovoltaic panel systems
- LED lighting fixtures
| Property | Value | Test Method |
|---|---|---|
| Color | Black | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ****** |
| Density (g/cm³) | 2.0 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 | 0.030~0.200 0.25~0.50 | 0.75~5.00 |
ASTM D374 |
| Hardness (Shroe 00) | 65 | 27 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @ 1MHz | 4.5 | ASTM D150 |
| Volume Resistivity | ＞1.0×10¹² Ohm-meter | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity | 1.0 W/m-K 1.0 W/m-K |
ASTM D5470 ISO22007 |
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
- Reinforcement Fabric: FG (Fiberglass)
- Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
- Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
- PET film or foam protection
- Paper card separation between layers
- Export carton packaging (inside and outside)
- Customized packaging available per customer requirements
Quantity: 5000 pieces
Estimated Time: To be negotiated
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