TIF035AB-05S Two-Part Thermally Conductive Putty 3.5W/mK with 30 Minute Cure Time and UL Recognition
Price:
0.1-100USD/tube
MOQ:
1000tube
Delivery Time:
3-8 WORK DAYS
Brand:
Ziitek
Product Description
Product Overview
TIF035AB-05S Series two-part thermally conductive putty with 3.5W/mK thermal conductivity, designed for efficient heat management in telecommunications and electronic applications. This liquid gap filling material cures quickly and provides reliable thermal interface performance.
Key Features
- High thermal conductivity: 3.5 W/mK
- UL recognized for safety compliance
- Naturally tacky surface requires no additional adhesive
- Two-part formulation for extended shelf life
- Excellent durability and reliability
- Optimized shear thinning for easy dispensing
Applications
- Notebook computers and mobile devices
- Set-top boxes and entertainment systems
- Power monitoring boxes and electrical enclosures
- High-speed mass storage drives
- Heat sinks for heat-generating semiconductors
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 3.5 W/mK | ISO22007-2 |
| Mix Ratio | 1:1 | - |
| Pot Life @25℃ | 30 minutes | - |
| Cure Time @25℃ | 60 minutes | - |
| Cure Time @100℃ | 30 minutes | Visual |
| Hardness | 45 shore00 | ASTM D2240 |
| Continuous Use Temperature | -45°C to 200°C | - |
| Volume Resistivity | 10¹² Ohm-meter | ASTM D257 |
| Flame Rating | 94V0 | E331100 |
| Specific Heat Capacity | 2.2 MJ/m³K | ISO22007-2 |
Packaging Options
Available in 50cc per piece (48 pieces per box) or 400cc per piece (9 pieces per box). Custom syringe packaging available for automated dispensing applications.
Documentation
Quality Assurance
Manufactured by Ziitek Electronic Material and Technology Ltd. with total quality control. Free samples available upon request. Delivery within 3-7 working days for in-stock items.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai