Magnetic Head Industry Atomic Layer Deposition ALD Machine OEM
Atomic Layer Deposition in Magnetic Head Industry
Applications
| Applications | Specific Purpose |
| Magnetic head |
Non-planar deposition insulating spacing layer |
Working Principle
Atomic layer deposition technology is that makes the precursors which will be involved in the reaction guided to the
reaction chamber sequentially (one precursor at a time) through different precursor conduits. By means of saturation
chemisorption on the surface of substrate, only one layer of precursor is adsorbed at a time. The excess precursors
and by-products will be purged away by inert gases Ar or N2 to achieve self-limitation.
Features
| Model | ALD-MH-X—X |
| Coating film system | AL2O3, TiO2, ZnO, etc |
| Coating temperature range | Normal temperature to 500℃ (Customizable) |
| Coating vacuum chamber size |
Inner diameter: 1200mm, Height: 500mm (Customizable) |
| Vacuum chamber structure | According to customer’s requirements |
| Background vacuum | <5×10-7mbar |
| Coating thickness | ≥0.15nm |
| Thickness control precision | ±0.1nm |
| Coating size | 200×200mm² / 400×400mm² / 1200×1200 mm², etc |
| Film thickness uniformity | ≤±0.5% |
| Precursor and carrier gas |
Trimethylaluminum, titanium tetrachloride, diethyl zinc, pure water, nitrogen, etc. |
| Note: Customized production available. | |
Coating Samples
Process Steps
→ Place the substrate for coating into the vacuum chamber;
→ Vacuumize the vacuum chamber at high and low temperature, and rotate the substrate synchronously;
→ Start coating: the substrate is contacted with precursor in sequence and without simultaneous reaction;
→ Purge it with high-purity nitrogen gas after each reaction;
→ Stop rotating the substrate after the film thickness is up to standard and the operation of purging and cooling is
completed, then take out the substrate after the vacuum breaking conditions are met.
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