Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry
Atomic Layer Deposition in Organic Electronic Packaging Industry
Applications
| Applications | Specific Purpose |
|
Organic electronic packaging
|
Packaging of organic light-emitting diode (OLED), etc. |
Working Principle
The advantage of atomic layer deposition technology is that, because the surface reaction of ALD technology is
self-limiting, materials of the desired precise thickness can be made by repeating this self-limitation constantly.
This technology has good step coverage and large area of thickness uniformity. Continuous growth makes nano
film materials pinhole-free and high-density.
Features
| Model | ALD-OEP-X—X |
| Coating film system | AL2O3, TiO2, ZnO, etc |
| Coating temperature range | Normal temperature to 500℃ (Customizable) |
| Coating vacuum chamber size |
Inner diameter: 1200mm, Height: 500mm (Customizable) |
| Vacuum chamber structure | According to customer’s requirements |
| Background vacuum | <5×10-7mbar |
| Coating thickness | ≥0.15nm |
| Thickness control precision | ±0.1nm |
| Coating size | 200×200mm² / 400×400mm² / 1200×1200 mm², etc |
| Film thickness uniformity | ≤±0.5% |
| Precursor and carrier gas |
Trimethylaluminum, titanium tetrachloride, diethyl zinc, pure water, nitrogen, etc. |
| Note: Customized production available. | |
Coating Samples
Process Steps
→ Place the substrate for coating into the vacuum chamber;
→ Vacuumize the vacuum chamber at high and low temperature, and rotate the substrate synchronously;
→ Start coating: the substrate is contacted with precursor in sequence and without simultaneous reaction;
→ Purge it with high-purity nitrogen gas after each reaction;
→ Stop rotating the substrate after the film thickness is up to standard and the operation of purging and cooling is
completed, then take out the substrate after the vacuum breaking conditions are met.
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