12 Layer PCB Multilayer Printed Circuit Board FR4 Material Hight TG Immserion Gold
Multilayer Circuit Board 12 Layer PCB FR4 Material Hight TG Immserion Gold
Main Features:
Part NO: Multi-Layer PCB0005
Layer Count: 12 Layer PCB
Finished Board Thickness: 1.6MM
Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H1
Min Lind Space&Width: 3.3/3.3mil
Application Area: Consumer Porducts
Outline Size: 210MM*78MM/3PCS
Outline tolerance: +/-0.13mm
Copper wall thickness for plated through holes: 25um
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
| Delivery Acceptance Requirements: | |
| Test | All boards are tested in accordance with IPC-9252A |
| Working Gerber | Paste layers must be provided on working gerbers. |
| If Paste layer is missing, alert us in EQ. | |
| Fab File | Check original customer Fab file if provided. |
| If there is a conflict between customer FAB and this | |
| document, please ask in your EQ questions. | |
| Approvals | Send working gerber and EQ together. |
| RoHS & REACH | All materials must be RoHS & REACH compliant. |
| All processes must be RoHS & REACH compliant. | |
| Documents | Send PDF copy of all test, measurement, conformance |
| and certificates. No paper or core sample needed. |
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