6 Layer Half Plated Hole PCB Bluetooth Module 1.0MM Board Thickness Cusomized
6 Layer Half Plated Hole PCB Bluetooth Module Used 1.0MM Board Thickness Cusomized PCB
Board Info:
1 Part NO: Half hole PCB0001
2 Layer Count: 6 Layer HDI PCB
3 Finished Board Thickness: 1.0MM tolerance is +/-0.1MM
4 Copper Thickness: 1/H/H/H/H/1 OZ
5 Min Lind Space&Width: 3/3mil
6 Application Area: Bluetooth Module
Our Capabilities:
| NO | Item | Capability |
| 1 | Layer Count | 1-24 Layers |
| 2 | Board Thickness | 0.1mm-6.0mm |
| 3 | Finished Board Max Size | 700mm*800mm |
| 4 | Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| 5 | Warp | <0.7% |
| 6 | Major CCL Brand | KB/NanYa/ITEQ/ShengYi/Rogers Etc |
| 7 | Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET |
| 8 | Drill Hole Diameter | 0.1mm-6.5mm |
| 9 | Out Layer Copper Thickness | 1/2OZ-8OZ |
| 10 | Inner Layer Copper Thickness | 1/3OZ-6OZ |
| 11 | Aspect Ratio | 10:1 |
| 12 | PTH Hole Tolerance | +/-3mil |
| 13 | NPTH Hole Tolerance | +/-1mil |
| 14 | Copper Thickness of PTH Wall | >10mil(25um) |
| 15 | Line Width And Space | 2/2mil |
| 16 | Min Solder Mask Bridge | 2.5mil |
| 17 | Solder Mask Alignment Tolerance | +/-2mil |
| 18 | Dimension Tolerance | +/-4mil |
| 19 | Max Gold Thickness | 200u'(0.2mil) |
| 20 | Thermal Shock | 288℃, 10s, 3 times |
| 21 | Impedance Control | +/-10% |
| 22 | Test Capability | PAD Size min 0.1mm |
| 23 | Min BGA | 7mil |
| 24 | Surface Treatment | OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc |
FAQ:
Q1: What is Turnkey PCB Assembly?
A1: Turnkey PCB Assembly is the complete PCB Assembly process which includes the fabrication of the board, procurement of components to be placed on the board, the PCB assembly process and other testing or quality control processes that are required to give customers the final assembled printed circuit board.
So, when a customer asks for turnkey PCB assembly, this means that they are looking to get a final PCB board and expect the PCB company to provide all the services required from start to finish.
The alternative to turnkey PCB assembly is to get each step in the PCB assembly process done separately or by different vendors. For example, one vendor would fabricate the board, then someone would be responsible for component procurement, and another company for PCB Assembly and testing of the final board. All this requires a significant amount of coordination.
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