ENIG 4 Layer GPS Module PCB Circuit Board With Half Plated Holes

4 Layer PCB With Half Plated Holes Used In GPS Module

Board Requirements:

1. Board Laminate:

Board layers 4 layer see layer stackup

Board material laminate should be 0.031inch +/-10%

Finished glass epoxy laminate, type nema grade or equivalent

Outer layer to be 0.5OZ Copper clad

Construction should meet class 94v-0

Layer construction alignment max: +-0.05mm

2 Holes:

Copper plate through all holes with a minimum wall thickness of 0.0254mm

Register tolerance : +-0.015mm

All holes must be drilled +-0.051mm with respect to center of drilled pad

3 Solder mask:

Liquid photo-imageable solder mask over bare copper per IPC-SM-840,TYPE B,CLASS3

4. Finish:

4.1 Copper plated through all holes

4.2 All other exposed conductive pattern areas not covered with solder mask shall be plated with ENIG(ELECTROLESS NICKEL IMMERSION GOLD) at a minimum of 0.05 micron thickness of hard gold over 3.0 to 6.0 micron thick electroless nickel plating

5 Board outline can not be violated. Board outline shall be free from tough edge, mouse bite etc.

6 This pcb must comply with the material restrictions for ROHS directive 2011/65/eu and amending directive 2015/863.