Witgain Technology Limited
                                                                                                           
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19 Years
Since 2007
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8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm

Price Negotiable
Price: negotiable
MOQ: 1 pcs/lot
Delivery Time: 20 days
Brand: WITGAIN PCB
Product Description

Multi Layer Circuit Board 8 Layer Printed Circuit Board Red Solder Mask

 

 

PCB Specifications:

 

1 Part NO: Multi-Layer PCB0026

2 Layer Count: 8 Layer  PCB

3 Finished Board Thickness: 2.0MM

4 Copper Thickness: 1/1/1/1/1/1 OZ

5 Min Lind Space&Width: 4/4 mil

6 Application Area: Industrial Control

 

 

 


Material Data Sheet:

 

S1130
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 135
Td IPC-TM-650 2.4.24.6 5% wt. loss 310
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 65
After Tg ppm/℃ 310
50-260℃ % 4.5
T260 IPC-TM-650 2.4.24.1 TMA min 13
T288 IPC-TM-650 2.4.24.1 TMA min <1
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 60S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 4.8E + 08
E-24/125 MΩ.cm 4.6E + 06
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 5.2E + 07
E-24/125 5.3E + 06
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 120
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 60
Electrical Strength IPC-TM-650 2.5.6.2 D-48/50+D-4/23 kV/mm
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.6
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.016
IEC 61189-2-721 10GHz --
Peel Strength(1oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.8
125℃ N/mm 1.6
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 500
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.15
CTI IEC30112 C-48/23/50, PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

Our Product Categories:

 

 

Our Product Categories
Material Kinds Layer Counts Treatments
FR4 Single Layer HASL Lead Free
CEM-1 2 Layer/Double Layer OSP
CEM-3 4 Layer Immersion Gold/ENIG
Aluminum Substrate 6 Layer Hard Gold Plating
Iron Substrate 8 Layer Immersion Silver
PTFE 10 Layer Immersion Tin
PI Polymide 12 Layer Gold fingers
AL2O3 Ceramic Substrate 14 Layer Heavy copper up to 8OZ
Rogers, Isola high frequency materials 16 Layer Half plating holes
Halogen free 18 Layer HDI Laser drilling
Copper based 20 Layer Selective immersion gold
  22 Layer immersion gold +OSP
  24 Layer Resin filled in vias

 

 

 

 

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Witgain Technology Limited
Location Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
Contact Person Steven YU

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