Witgain Technology Limited
                                                                                                           
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Since 2007
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Red Solder Mask FR4 Circuit Board 1 OZ Copper Thickness OSP Treatment

Price Negotiable
Price: negotiable
MOQ: 1 pcs/lot
Delivery Time: 20 days
Brand: WITGAIN PCB
Product Description

Red Solder Mask FR4 Substrate Material 1 OZ Copper Thickness OSP Treatment

 

 

PCB Specifications:

 

1 Part NO: Multi-Layer PCB000351

2 Layer Count: 8 Layer  PCB

3 Finished Board Thickness: 1.6MM

4 Copper Thickness: 1/1/1/1/1/1 OZ

5 Min Lind Space&Width: 3.5/3.5 mil

6 Application Area: Amplifier

 

 

 


Material Data Sheet:

 

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

 

 

 

FAQ:

 

Q1: What are PCB Mouse bites?

A1: 

Mouse bites also known as perforated breakaway tabs in a PCB are small perforations / pricks on the board which allow for panelizing and depanelizing smaller groups of PCBs together. This way multiple PCB boards can be assembled together, thereby saving time and making the process cost-effective. The assembled PCBs can be separated by applying pressure on the sections of the board that have perforations. Once separated, i.e after the depanelization process, the board looks like it has mouse bites in these sections.

Below is an Image of PCBs assembled to each other with the help of mouse bites.

Below is an Image of a PCB being depaneled easily which is also made possible due to mouse bites. You can also see the sharp edges after the boards have been separated, these are called mouse bites.

When multiple PCBs are connected using mouse bites they have a smooth finish. When compared to PCB boards connected using V-Scoring, boards connected with mouse bites are easier to depanelize i.e they require less force.

Precautions to take before inserting Mouse bites on a PCB

  • Develop an adequate number of mouse bites to support a board completely when paneled with other boards
  • Do not place the mouse bites close to sensitive component areas or circuitry. This will cause the board to experience breakout stress which can damage sensitive components or sections of the board
  • The spacing between two mouse bites must range between 60mm to 90mm

 

 

 

 

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Witgain Technology Limited
Location Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
Contact Person Steven YU

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