TIS580-12 Dealcoholized Thermally Conductive Silicone Glue - 1.2W/mK Thermal Conductivity, 20K cps Viscosity
TIS580-12 is a one-component, dealcoholized thermally conductive silicone adhesive that cures at room temperature. This advanced material provides excellent heat conduction and strong adhesion for electronic components, forming a high-hardness elastomer that firmly attaches to substrates and minimizes thermal impedance.
- High thermal conductivity: 1.2W/mK
- Excellent electrical insulation properties
- Superior adhesion to copper, aluminum, and stainless steel
- Dealcoholized formulation prevents metal corrosion
- Low viscosity ensures void-free surface application
- Extended working life and low shrinkage
- Excellent thermal shock resistance and solvent/water resistance
Ideal replacement for thermal pastes and pads in gap-filling applications between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Replaces traditional mechanical fastening methods with more reliable thermal conduction, simplified handling, and cost-effective performance.
Common applications include: integrated circuits in portable computers, microprocessors, high-power LEDs, internal storage modules, cache systems, DC/AC translators, IGBT and power modules, semiconductor encapsulation, relay switches, rectifiers, and transformers.
| Property | Value | Test Method |
|---|---|---|
| Appearance | White paste | Visual |
| Density (g/cm³, 25℃) | 1.2 | ASTM D297 |
| Tack-free time (min, 25℃) | ≤20 | Internal Method |
| Cure type | Dealcoholized | Internal Method |
| Viscosity @25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time (days, 25℃) | 3-7 | Internal Method |
| Elongation (%) | ≥150 | ASTM D412 |
| Hardness (Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength (MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength (N/mm) | ＞3.5 | ASTM D1876 |
| Operation temperature (℃) | -60～250 | Internal Method |
| Volume Resistivity (Ω*cm) | 2.0×10¹⁶ | ASTM D257 |
| Dielectric Strength (KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m*K) | 1.2 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
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