TIF100-10-02F Silicone Thermal Pad 1.5 W/mK Thermal Conductivity 0.5-5.0mm Thickness Range

TIF®100-10-02F Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from individual components or entire PCBs.

• Thermal conductivity: 1.5 W/mK
• Exceptional thermal performance at low pressures
• Excellent thermal conductive properties
• Moldability for complex parts and assemblies
• Soft and compressible for low stress applications

• RDRAM memory modules
• Micro heat pipe thermal solutions
• Set top boxes and audio/video components
• IT infrastructure and GPS navigation devices
• CD-Rom, DVD-Rom cooling systems
• LED Power Supply applications

Packaging includes PET film or foam protection, paper card separation between layers, and export cartons. Customized packaging available upon request. Lead time for 5000 pieces is negotiable.

Vietnam Ziitek Technology Company Limited specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, full product lines, and flexible production capabilities to support your design requirements.