TIE380-45 Thermal Conductive Epoxy Glue - 4.5W/mK Thermal Conductivity, 150,000 cPs Viscosity for Industrial Applications
TIE380-45 is a one-component, heat-cured epoxy adhesive offering excellent thermal conductivity and superior bond strength. Its optimized rheology enables efficient stencil printing, making it ideal for high-speed production environments.
- High thermal conductivity: 4.5W/mK
- Excellent adhesion performance and maneuverability
- Low shrinkage during curing
- Low viscosity for easy application and reduced gas emissions
- Superior solvent and water resistance
- Extended working time for complex assemblies
- Outstanding thermal shock resistance
| Property | Value | Test Method |
|---|---|---|
| Chemical Type | Epoxy | - |
| Appearance (Uncured) | Gray Paste | Visual |
| Appearance (Cured) | Dull Gray Solid | Visual |
| Components | One Component | - |
| Heat Capacity | 0.7 J/g·K | ASTM C351 |
| Key Substrates | Metals, Ceramics | - |
| Hardness | 92 Shore A | ASTM 2240 |
| Continuous Use Temperature | -40 to 180℃ | - |
| Tensile Strength (Al/Al @25°C) | >2900 psi | - |
| Thermal Conductivity | 4.5 W/m·K | ASTM D5470 |
Color: Gray
Viscosity @25℃: 150,000 cPs
Specific Gravity @25℃: 2.2 g/cc
Shelf Life: 10 days @25℃ / 6 months @0℃
Storage conditions and temperature will affect shelf life
| Curing Temperature | Curing Time |
|---|---|
| 100℃ | 4 Hours |
| 125℃ | 2 Hours |
| 150℃ | 30 Minutes |
| 170℃ | 5 Minutes |
Standard packaging: 1kg per can
Vietnam Ziitek Technology Company Limited specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to be your reliable thermal management partner.
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