TIF100-66U series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from heat-generating electronic components, thereby enhancing efficiency and extending component lifespan.

• Excellent thermal conductivity: 1.2W/mK
• Naturally tacky surface requiring no additional adhesive coating
• Soft and compressible design for low-stress applications
• Available in various thickness options
• RoHS compliant for environmental safety
• UL recognized for quality assurance

• Semiconductor automated test equipment (ATE)
• CPU and GPU cooling solutions
• Motherboard and display card thermal management
• Notebook and laptop cooling systems
• Power supply units and heat pipe solutions
• Memory modules and mass storage devices
• Automotive electronics and set-top boxes
• Audio and video component thermal regulation

8" x 16" (203mm x 406mm) and 16" x 18" (406mm x 457mm)

TIF series individual die-cut shapes are available upon request.

• Pressure Sensitive Adhesive: Request "A1" suffix for one side or "A2" for double side
• Reinforcement: Fiberglass reinforced sheets available

Vietnam Ziitek Technology Company Limited is a dedicated R&D and production company specializing in thermal conductive materials. With multiple production lines and advanced processing technologies, we provide comprehensive thermal solutions for diverse applications.