TIF100-11S Silicone Thermal Pad 1.5W/mK Thermal Conductivity 0.5mm to 5.0mm Thickness Range

TIF®100-11S series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat from electronic components to metal housings or dissipation plates, thereby enhancing thermal efficiency and extending component lifespan.

• Excellent thermal conductivity: 1.5W/mK
• Naturally tacky surface requiring no additional adhesive
• Soft and compressible for low-stress applications
• Available in various thickness options
• RoHS compliant and UL recognized

• Semiconductor automated test equipment (ATE)
• CPU and GPU cooling solutions
• Motherboards and display cards
• Notebook computers and power supplies
• Heat pipe thermal management systems
• Memory modules and storage devices
• Automotive electronics and set-top boxes
• Audio and video components

Standard sheet size: 8" × 16" (203mm × 406mm)

Custom die-cut shapes available upon request

Pressure Sensitive Adhesive: Single-side adhesive (A1 suffix) or double-side adhesive (A2 suffix)

Reinforcement: Fiberglass reinforced sheets available

Vietnam Ziitek Technology Company Limited specializes in R&D and production of thermal conductive materials, featuring advanced production equipment and optimized processes to deliver comprehensive thermal solutions for diverse applications.