CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
                                                                                                           
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TIF100-20-11US Ultra-Soft Silicone Thermal Pad 2.0W/m-K 0.5-5.0mm Thickness for Electronics Cooling

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description
TIF100-20-11US Ultra-Soft Silicone Thermal Pad
The TIF100-20-11US is an extremely soft gap filling material with 2.0W/m-K thermal conductivity, specially formulated for high-performance applications requiring low assembly stress. This ultra-soft silicone thermal pad offers exceptional thermal performance at low pressures due to its unique filler package and ultra-low modulus resin formulation.
Key Features
  • Excellent thermal conductivity: 2.0W/mK
  • Naturally tacky surface requiring no additional adhesive coating
  • Soft and compressible for low-stress applications
  • Available in various thickness options
  • RoHS compliant and UL recognized
  • Highly conformal to rough or irregular surfaces
  • Protective liners supplied on both sides for ease of use
TIF100-20-11US Ultra-Soft Silicone Thermal Pad product image showing material texture and construction
Application Areas
  • Semiconductor automated test equipment (ATE)
  • CPU and GPU cooling solutions
  • Display cards and motherboard applications
  • Notebook computers and power supplies
  • Heat pipe thermal management systems
  • Memory modules and mass storage devices
  • Automotive electronics and set-top boxes
  • Audio and video components
Technical Specifications
Property Value Test Method
Color Gray Visual
Construction & Composition Ceramic filled silicone elastomer Internal
Density 2.7g/cm³ ASTM D297
Thickness Range 0.020" (0.5mm) ~ 0.200" (5.0mm) Internal
Hardness 20±5 Shore 00 ASTM 2240
Continuous Use Temperature -40 to 200℃ Internal
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0×10¹² Ohm-cm ASTM D257
Fire Rating 94 V0 UL E331100
Thermal Conductivity 2.0W/m-K ASTM D5470
Product Dimensions & Customization
Standard sheet size: 8"×16" (203mm×406mm)
Individual die-cut shapes available upon request
Adhesive Options
Pressure sensitive adhesive available:
  • Single-side adhesive: Add "A1" suffix to product code
  • Double-side adhesive: Add "A2" suffix to product code
Reinforcement Options
TIF series sheet types can be reinforced with fiberglass for enhanced structural integrity.
Ziitek thermal conductive interface materials manufacturing and application examples
Manufacturing & Custom Orders
We are a manufacturer based in Vietnam specializing in thermal conductive interface materials. Custom orders are welcome with options for dimension, shape, color, adhesive coating (single or double side), and fiberglass reinforcement.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person Sophia

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