CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
                                                                                                           
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Since 2006
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TIF100-30-02 Ultra-Soft Silicone Thermal Gap Filler Pad 3.0W/mK Conductivity 0.5-5.0mm Thickness

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description
TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad
The TIF100-30-02 thermal gap filler pad is specifically designed for applications requiring minimal pressure on components. This viscoelastic material provides excellent low-stress vibration dampening and shock absorption characteristics while offering electrical isolation for high-voltage applications.
Key Features
  • High thermal conductivity: 3.0W/mK
  • Naturally tacky surface requiring no additional adhesive
  • Ultra-soft and compressible for low-stress applications
  • Multiple thickness options available
  • RoHS compliant and UL recognized
  • Moldable for complex component shapes
TIF100-30-02 thermal conductive gap filler pad product image showing material texture and application
Primary Applications
  • Semiconductor automated test equipment (ATE)
  • CPU and GPU cooling systems
  • Motherboard and display card thermal management
  • Notebook and portable device cooling
  • IT infrastructure and server applications
  • GPS navigation and portable electronics
  • CD/DVD-ROM cooling systems
  • LED power supplies and controllers
  • LED ceiling lamp thermal management
Technical Specifications
Property Value Test Method
Color Gray Visual
Construction & Composition Ceramic filled silicone elastomer -
Density 3.0g/cm³ ASTM D297
Thickness Range 0.020" (0.5mm) to 0.200" (5.0mm) -
Hardness 45 Shore 00 ASTM 2240
Continuous Use Temperature -40 to 160℃ -
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity 1.0×10¹² Ohm-cm ASTM D257
Fire Rating 94 V0 UL E331100
Thermal Conductivity 3.0W/m-K ASTM D5470
Product Dimensions & Options
  • Standard sheet size: 8" × 16" (203mm × 406mm)
  • Custom die-cut shapes available upon request
  • Pressure sensitive adhesive options: A1 suffix (one side) or A2 suffix (both sides)
  • Fiberglass reinforcement available for sheet types
TIF100-30-02 thermal pad application examples and installation guidance
Manufacturer Profile

Ziitek Company brings over 19 years of professional R&D experience in thermal interface materials, featuring unique formulations and core technological advantages. Our commitment is to deliver quality, competitive products for long-term global business partnerships.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person Sophia

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