TIF100-30-02 Ultra-Soft Silicone Thermal Gap Filler Pad 3.0W/mK Conductivity 0.5-5.0mm Thickness
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIF100-30-02 Ultra-Soft Silicone Thermal Conductive Gap Filler Pad
The TIF100-30-02 thermal gap filler pad is specifically designed for applications requiring minimal pressure on components. This viscoelastic material provides excellent low-stress vibration dampening and shock absorption characteristics while offering electrical isolation for high-voltage applications.
Key Features
- High thermal conductivity: 3.0W/mK
- Naturally tacky surface requiring no additional adhesive
- Ultra-soft and compressible for low-stress applications
- Multiple thickness options available
- RoHS compliant and UL recognized
- Moldable for complex component shapes
Primary Applications
- Semiconductor automated test equipment (ATE)
- CPU and GPU cooling systems
- Motherboard and display card thermal management
- Notebook and portable device cooling
- IT infrastructure and server applications
- GPS navigation and portable electronics
- CD/DVD-ROM cooling systems
- LED power supplies and controllers
- LED ceiling lamp thermal management
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | - |
| Density | 3.0g/cm³ | ASTM D297 |
| Thickness Range | 0.020" (0.5mm) to 0.200" (5.0mm) | - |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Continuous Use Temperature | -40 to 160℃ | - |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 5.0 MHz | ASTM D150 |
| Volume Resistivity | 1.0×10¹² Ohm-cm | ASTM D257 |
| Fire Rating | 94 V0 | UL E331100 |
| Thermal Conductivity | 3.0W/m-K | ASTM D5470 |
Product Dimensions & Options
- Standard sheet size: 8" × 16" (203mm × 406mm)
- Custom die-cut shapes available upon request
- Pressure sensitive adhesive options: A1 suffix (one side) or A2 suffix (both sides)
- Fiberglass reinforcement available for sheet types
Manufacturer Profile
Ziitek Company brings over 19 years of professional R&D experience in thermal interface materials, featuring unique formulations and core technological advantages. Our commitment is to deliver quality, competitive products for long-term global business partnerships.
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Company
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location
Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person
Sophia