Ziitek TIF®100-45-56S is a silicone-based thermally conductive gap pad featuring unreinforced construction for enhanced compliance. This product offers low hardness, excellent conformability, and electrical isolation properties. The low modulus characteristics ensure optimal thermal performance with easy handling.

• Excellent thermal conductivity: 4.5W/mK
• Naturally tacky surface requiring no additional adhesive coating
• Soft and compressible design for low-stress applications
• Available in various thickness options

• Semiconductor automated test equipment (ATE)
• Power monitoring systems and AD-DC power adapters
• Rainproof and waterproof LED power systems
• SMD LED modules and flexible LED strips
• LED panel lights, floor lights, and router systems

Standard Size: 8" × 16" (203mm × 406mm)

Custom Shapes: Individual die-cut shapes available upon request

Adhesive Options: Single-side adhesive (A1 suffix) or double-side adhesive (A2 suffix)

Reinforcement: Fiberglass reinforced sheets available

Ziitek brings over 19 years of professional R&D experience in thermal interface materials, featuring unique formulations that represent our core technological advantages. Our commitment is to deliver quality, competitive products to global customers for long-term business partnerships.