TIF100-60-11F Thermal Silicone Pad 6.0W/mK for Heat Sink Cooling 0.5mm to 5.0mm Thickness
The Ziitek TIF®100-60-11F thermal silicone pad utilizes a specialized manufacturing process with silicone as the base material, incorporating thermal conductive powder and flame retardant additives to create an effective thermal interface material that reduces thermal resistance between heat sources and heat sinks.
- High thermal conductivity: 6.0W/mK
- Excellent heat transfer performance
- Naturally adhesive surface requiring no additional coatings
- Soft and compressible design for low-stress applications
- Available in various thickness options
- Semiconductor automated test equipment (ATE)
- Power monitoring systems and enclosures
- AC-DC power adapters and converters
- Rainproof and waterproof LED power systems
- SMD LED modules and flexible LED strips
- LED panel lights and floor lighting
- Network routers and telecommunications equipment
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | - |
| Density | 3.25g/cc | ASTM D297 |
| Thickness Range | 0.020" (0.5mm) ~ 0.200" (5.0mm) | ASTM D374 |
| Hardness | 60 Shore 00 | ASTM 2240 |
| Continuous Use Temperature | -40 to 160℃ | - |
| Dielectric Breakdown Voltage | 10.0K VAC | ASTM D149 |
| Dielectric Constant | 6.0 MHz | ASTM D150 |
| Volume Resistivity | 5.2×10¹³ Ohm-cm | ASTM D257 |
| Fire Rating | 94 V0 | UL E331100 |
| Thermal Conductivity | 6.0W/m-K | ASTM D5470 |
Standard Sheet Size: 8" × 16" (203mm × 406mm)
Thickness Options: 0.020" to 0.200" (0.5mm to 5.0mm)
Custom die-cut shapes available upon request
Pressure Sensitive Adhesive: Single-side (A1 suffix) or double-side (A2 suffix)
Reinforcement: Fiberglass reinforced sheets available
Vietnam Ziitek Technology Company Limited specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to serve as your reliable thermal management partner.
Contact us through our website messaging system, email, or phone to request samples tailored to your specific requirements.
All data is verified using Hot Disk and ASTM D5470 testing methods to ensure accurate thermal conductivity measurements.
Selection depends on power source wattage and heat dissipation requirements. Provide your application details and power specifications for personalized recommendations.
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