TIF100 H80-11E Thermal Conductive Silicone Pad 8.0W/mK 0.5-5.0mm Thickness for LED & Electronics Cooling

Ziitek TIF®100 H80-11E thermal conductive silicone pad efficiently fills gaps between heating and cooling components, facilitating optimal heat transfer while providing insulation, damping, and sealing functions. This advanced material supports equipment miniaturization and ultra-thin design requirements with its wide thickness range and excellent thermal performance.

• Excellent thermal conductivity: 8.0W/mK
• Naturally tacky surface eliminates need for additional adhesive coating
• Soft and compressible design for low-stress applications
• Available in multiple thickness options from 0.5mm to 5.0mm

• Semiconductor automated test equipment (ATE)
• Power monitoring systems and AD-DC power adapters
• Rainproof and waterproof LED power systems
• SMD LED modules, flexible LED strips, and panel lights
• LED floor lighting and router thermal management

Standard Size: 8" × 16" (203mm × 406mm)

Custom Die-Cutting: Individual die-cut shapes available upon request

Adhesive Options: Single-side adhesive (A1 suffix) or double-side adhesive (A2 suffix)

Reinforcement: Fiberglass reinforced sheets available

Ziitek is a high-tech enterprise specializing in thermal interface materials (TIMs) with comprehensive R&D, manufacturing, and testing capabilities. All products comply with UL94 V-0, SGS, and ROHS certifications, ensuring reliable performance and safety for your thermal management applications.