TIF112-12-10S-K1 Thermal Pad 1.2W/mK for Laptop Cooling 0.5-5.0mm Thickness
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIF112-12-10S-K1 Thermal Pad Overview
The TIF®112-12-10S-K1 series thermally conductive interface materials are gap fillers reinforced with Kapton on one side and adhesive on the other. These pads effectively fill air gaps between heating elements and heat dissipation components, featuring flexibility and viscoelastic properties ideal for uneven surfaces. The smooth, puncture-resistant, tear-resistant, and wear-resistant reinforcement surface makes them perfect for reworking and plug-in devices.
Key Features
- Excellent thermal conductivity: 1.2W/mK
- Naturally tacky surface requires no additional adhesive coating
- Soft and compressible for low-stress applications
- Available in various thicknesses from 0.5mm to 5.0mm
- RoHS compliant and UL recognized
Application Areas
- Semiconductor automated test equipment (ATE)
- CPU and display card cooling
- Audio and video components
- IT infrastructure and GPS navigation devices
- CD-ROM and DVD-ROM cooling systems
- LED power supplies, controllers, and ceiling lamps
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Color | Gray/Light amber | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | - |
| Density | 2.2g/cm³ | ASTM D297 |
| Thickness Range | 0.020" (0.5mm) ~ 0.200" (5.0mm) | - |
| Hardness | 60 ±5 Shore 00 | ASTM 2240 |
| Continuous Use Temperature | -40 to 120℃ | - |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0×10¹² Ohm-cm | ASTM D257 |
| Fire Rating | 94 V0 | UL equivalent |
| Thermal Conductivity | 1.2W/m-K | ASTM D5470 |
Standard Sizes & Custom Options
Standard sheet size: 8" x 16" (203mm x 406mm). Individual die-cut shapes available upon request.
Pressure Sensitive Adhesive Options
Request adhesive on one side with "A1" suffix. Request adhesive on double side with "A2" suffix.
Reinforcement Options
TIF series sheets can be reinforced with fiberglass for enhanced durability.
Manufacturer Information
Ziitek thermal conductive interface materials are manufactured in Vietnam and extensively used in mainboards, VGA cards, notebooks, DDR products, LCD TVs, PDP products, server power products, and various LED lighting applications.
Quality Certifications
- ISO9001:2015
- ISO14001:2004
- IATF16949:2016
- IECQ QC 080000:2017
- UL Recognition
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer based in Vietnam.
How do I request customized samples?
To request samples, leave a message on our website or contact us via email or phone.
What thermal conductivity test method is used?
All data in the specification sheet are actual tested values using Hot Disk and ASTM D5470 methods.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location
Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person
Sophia