TIS580-20 Dealcoholized Thermally Conductive Silicone Adhesive - 2.0W/mK Thermal Conductivity, 20K cps Viscosity
Price:
0.1-10 USD/kg
MOQ:
10KG
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
TIS580-20 Dealcoholized Thermally Conductive Silicone Adhesive
TIS™580-20 Series is a dealcoholized, one-component, room temperature cure thermally conductive silicone adhesive designed for electronic component bonding and heat dissipation applications.
Product Overview
This adhesive provides excellent heat conduction and strong adhesion to electronic components. It cures to a higher hardness elastomer that firmly attaches to substrates, resulting in lower thermal impedance and more effective heat transfer between heat sources, heat sinks, motherboards, and metal casings.
Key Features
- Thermal conductivity: 2.0W/mK
- Excellent electrical insulation properties
- Ready-to-use formulation
- Low shrinkage during curing
- Low viscosity for void-free surfaces
- Excellent adhesion to copper, aluminum, and stainless steel
- Non-corrosive dealcoholized system
- Good solvent and water resistance
- Extended working life
- Excellent thermal shock resistance
Applications
Ideal for replacing thermal pastes and pads in gap-filling applications, including heat conduction between LED aluminum motherboards and heat sinks, high-power electrical modules and heat sinks. Replaces traditional mechanical fastening methods with more reliable thermal conduction, simplified handling, and cost-effectiveness. Applications include integrated circuits in portable computers, microprocessors, high-power LEDs, internal storage modules, cache systems, DC/AC translators, IGBT and power modules, semiconductor encapsulation, relay switches, rectifiers, and transformers.
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Appearance | White paste | Visual |
| Density (g/cm³, 25℃) | 1.6 | ASTM D297 |
| Tack-free time (min, 25℃) | ≤20 | Internal Method |
| Cure type | Dealcoholized | Internal Method |
| Viscosity @25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time (days, 25℃) | 3-7 | Internal Method |
| Elongation (%) | ≥200 | ASTM D412 |
| Hardness (Shore A) | 45 | ASTM D2240 |
| Lap Shear Strength (MPa) | ≥2.5 | ASTM D1876 |
| Peel Strength (N/mm) | ＞5 | ASTM D1876 |
| Operation temperature (℃) | -60～250 | Internal Method |
| Volume Resistivity (Ω*cm) | 2.0×10¹⁶ | ASTM D257 |
| Dielectric Strength (KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m*K) | 2.0 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
Packaging
300ml/Tube, 24PCS/Box
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Get in Touch
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Company
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
Location
Plot CN4, Ming Lang Industrial Cluster, Thu Tri Commune, Hung Yen Province, Vietnam
Contact Person
Sophia